Hiroki Oshida

Title: Hiroki Oshida: Innovator in Hollow Package Technology

Hiroki Oshida is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of packaging technology, particularly with his innovative designs and methods. His work focuses on creating efficient and effective packaging solutions that meet modern demands.

Latest Patents

Hiroki Oshida holds a patent for a hollow package and the method for manufacturing it. This hollow package includes a substrate, an element, a partition wall, and a top plate. It features one or more closed hollow parts that are covered by the substrate, the partition wall, and the top plate. The components are sealed with a cured product of a sealing resin composition. The top plate and the partition wall are made from an organic material, with specific thicknesses and widths that fall within predetermined ranges. The sealing resin composition consists of an epoxy resin and an inorganic filler, ensuring durability and functionality.

Career Highlights

Hiroki Oshida is currently employed at Nippon Kayaku Kabushiki Kaisha, where he continues to develop innovative packaging solutions. His work has garnered attention for its practicality and effectiveness in various applications.

Collaborations

Hiroki has collaborated with talented coworkers, including Tadashi Naito and Nao Honda. Their combined expertise has contributed to the advancement of packaging technologies within their organization.

Conclusion

Hiroki Oshida's contributions to hollow package technology exemplify the importance of innovation in packaging solutions. His patent reflects a commitment to enhancing product safety and efficiency. His work continues to influence the industry and inspire future advancements.