Location History:
- Koufu, JP (2014)
- Kofu, JP (2009 - 2019)
Company Filing History:
Years Active: 2009-2019
Title: Hidetoshi Ohta: Innovator in Composite Materials and Cooling Technologies
Introduction
Hidetoshi Ohta is a prominent inventor based in Kofu, Japan. He has made significant contributions to the field of materials science and cooling technologies, holding a total of seven patents. His innovative work focuses on enhancing the properties of composite materials and improving cooling processes.
Latest Patents
One of Hidetoshi Ohta's latest patents is for a composite resinous material particle and the process for producing it. This invention involves a resin material particle that serves as a base for resin molding products, incorporating a conductive nano-material. The design features a dispersion mixing layer that ensures the conductive nano-material is evenly distributed throughout the resin particle, creating a conductive layer that enhances the material's properties.
Another notable patent is for a sub-zero treatment device. This device is designed to uniformly cool a target object while minimizing the amount of liquid refrigerant required. It includes an exhaust member that extends from a cooling tank to the interior of the cooling target object mounting chamber, optimizing the cooling process.
Career Highlights
Hidetoshi Ohta is associated with Taiyo Nippon Sanso Corporation, where he applies his expertise in developing advanced materials and cooling technologies. His work has been instrumental in pushing the boundaries of innovation in these fields.
Collaborations
Throughout his career, Hidetoshi has collaborated with notable colleagues, including Hiroshi Sanui and Yuji Nomura. These partnerships have contributed to the successful development of his patented technologies.
Conclusion
Hidetoshi Ohta's contributions to the fields of composite materials and cooling technologies highlight his innovative spirit and dedication to advancing science. His patents reflect a commitment to improving material properties and efficiency in cooling processes.