Company Filing History:
1 out of 1 
1 out of 832,812 Years Active: 2007
Title: Hidetoshi Murakami: Innovator in Multilayer Printed Wiring Board Technology
Introduction
Hidetoshi Murakami is a notable inventor based in Iwate, Japan. He has made significant contributions to the field of printed circuit board manufacturing. His innovative approach has led to advancements that address common issues in the industry.
Latest Patents
Hidetoshi Murakami holds a patent for a "Method and apparatus for manufacturing multilayer printed wiring board." This invention aims to provide a production method and apparatus for multilayered printed-circuit boards that eliminate resin flow issues and resolve problems related to board thickness discrepancies and misregistration. The method involves stacking a laminated sheet covered with conductive foil, a prepreg, and another laminated sheet covered with conductor for the inner layer. Before pressurizing and heating, gas is sprayed onto the surface to eliminate impurities, ensuring a high-quality final product. He has 1 patent to his name.
Career Highlights
Throughout his career, Hidetoshi has worked with various companies, including Kabushiki Kaisha Daishodenshi. His expertise in the field has allowed him to develop innovative solutions that enhance the manufacturing process of printed wiring boards.
Collaborations
Hidetoshi has collaborated with notable individuals in the industry, including his coworker Tadahiro Ohmi. Their joint efforts have contributed to advancements in technology and manufacturing processes.
Conclusion
Hidetoshi Murakami's contributions to multilayer printed wiring board technology demonstrate his innovative spirit and dedication to improving manufacturing methods. His patent reflects a significant advancement in the field, showcasing his expertise and commitment to excellence.