Company Filing History:
Years Active: 2005
Title: Inventor Profile: Hideo Satou from Osaka, JP
Introduction
Hideo Satou is an esteemed inventor based in Osaka, Japan, recognized for his contributions in the field of adhesive technology. With a focused innovation approach, he has developed a unique solution that enhances the functionality and usability of pressure-sensitive adhesive tapes.
Latest Patents
Satou holds a patent for a "Pressure-sensitive adhesive tape for fixing a joint portion and method of using the same." This innovative adhesive tape features a support of a generally rectangular shape with a pressure-sensitive adhesive layer on one side. Designed to improve joint fixation, the tape includes a non-adherent or weakly adherent portion, allowing for versatility in application. Additionally, the tape incorporates a cut line that extends from the end of the shorter side to near the non-adherent or weakly adherent portion, optimizing its use in various settings.
Career Highlights
Hideo Satou is associated with Nitto Denko Corporation, a leading company in advanced materials and adhesive solutions. Throughout his tenure, he has made significant strides in developing innovative adhesive products that meet the demands of modern technology and industry. His keen insights and dedication to research and development have propelled the company's reputation in the adhesives market.
Collaborations
In his collaborative efforts, Satou has worked alongside notable coworkers such as Masayuki Konno and Kodo Kishida. Their combined expertise in adhesive technologies has fostered a productive environment that encourages innovation and the sharing of ideas, leading to numerous advancements in their field.
Conclusion
Hideo Satou's work exemplifies the spirit of innovation within the adhesive industry. His patent for a pressure-sensitive adhesive tape demonstrates his commitment to improving joint fixing methodologies. As part of Nitto Denko Corporation, Satou continues to contribute to advancements in adhesive technology, setting a benchmark for future inventors in the realm of innovative solutions.