Kyoto, Japan

Hideo Ohnishi

USPTO Granted Patents = 2 


 

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018-2024

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2 patents (USPTO):Explore Patents

Title: Hideo Ohnishi: Innovator in Heat Seal and Film Punching Technologies

Introduction

Hideo Ohnishi is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of packaging technology, particularly through his innovative patents. With a total of two patents to his name, Ohnishi has demonstrated a commitment to enhancing manufacturing processes.

Latest Patents

Ohnishi's latest patents include a heat seal device and a plastic film punching apparatus. The heat seal device features at least two primary biasing members and a secondary biasing member. These components work together to bias the first heat seal member towards a second heat seal member when bag components are sandwiched between them. The design allows for the adjustment of the biasing force applied to the first heat seal member, enhancing the efficiency of the sealing process.

The plastic film punching apparatus is designed to improve waste removal during the punching process. In this apparatus, a plastic film is sandwiched between male and female blades. The female blade has two opposite surfaces, and the male blade pushes the waste to protrude from the second surface. A vacuum source works in conjunction with an opening to suck air and generate airflow, effectively removing the waste.

Career Highlights

Hideo Ohnishi is associated with Totani Corporation, a company known for its advancements in packaging machinery. His work at Totani has allowed him to focus on developing innovative solutions that streamline production processes and improve product quality.

Collaborations

Ohnishi collaborates with Takashi Fujita, a fellow innovator in the field. Their partnership has contributed to the development of cutting-edge technologies that enhance the efficiency of packaging systems.

Conclusion

Hideo Ohnishi's contributions to the field of packaging technology through his patents reflect his innovative spirit and dedication to improving manufacturing processes. His work continues to influence the industry and pave the way for future advancements.

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