Ichihara, Japan

Hideo Ago


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 1989

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1 patent (USPTO):Explore Patents

Title: Hideo Ago: Innovator in Polycarbonate Technology

Introduction

Hideo Ago is a prominent inventor based in Ichihara, Japan. He is known for his significant contributions to the field of polycarbonate materials, particularly in the production of disc substrates. His innovative work has led to advancements that enhance the quality and efficiency of these materials.

Latest Patents

Hideo Ago holds a patent for "Polycarbonate for disc substrate having low bisphenol content." This invention focuses on a polycarbonate suitable for the production of disc substrates. The patent outlines a process for efficiently producing this polycarbonate, which features a low molecular weight polymer content of not more than 3% by weight. Additionally, it specifies an unreacted bisphenol content of not more than 20 ppm and a methylene chloride content of not more than 20 ppm. The polycarbonate can be obtained by extracting impurity-containing powdery polycarbonate with organic solvents such as acetone and methyl ethyl ketone. This innovative material is particularly suitable for the production of high-quality disc substrates.

Career Highlights

Hideo Ago is associated with Idemitsu Petrochemical Co., Ltd., where he has made significant contributions to the development of advanced materials. His work has been instrumental in enhancing the performance and quality of polycarbonate products.

Collaborations

Hideo has collaborated with notable colleagues, including Kazunari Otsubo and Motonobu Ezoe. Their combined expertise has contributed to the success of various projects within the company.

Conclusion

Hideo Ago's innovative work in polycarbonate technology has made a lasting impact on the industry. His patent for low bisphenol content polycarbonate demonstrates his commitment to improving material quality and production efficiency.

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