Osaka, Japan

Hideki Mitsuda


Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:

goldMedal1 out of 832,843 
Other
 patents

Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: The Innovations of Hideki Mitsuda

Introduction

Hideki Mitsuda is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of pressure-sensitive adhesives. His innovative work has led to the development of a unique adhesive that showcases well-balanced characteristics.

Latest Patents

Mitsuda holds a patent for a pressure-sensitive adhesive and surface protecting material. This invention comprises 100 parts by weight of an isobutylene polymer that has been masticated in an organic solvent with a radical generator. Additionally, it includes 0.001 to 5 parts by weight of at least one release control agent selected from a specific group of alcohols and carboxylic acids. The adhesive is designed to provide excellent initial adhesion, retention of initial adhesion, and weather resistance.

Career Highlights

Throughout his career, Mitsuda has focused on enhancing adhesive technologies. His work has been recognized for its practical applications in various industries. He has demonstrated a commitment to innovation and quality in his field.

Collaborations

Mitsuda has collaborated with notable colleagues, including Mitsuyoshi Shirai and Isamu Teranishi. These partnerships have contributed to the advancement of adhesive technologies and have fostered a collaborative environment for innovation.

Conclusion

Hideki Mitsuda's contributions to the field of pressure-sensitive adhesives highlight his innovative spirit and dedication to quality. His patent reflects a significant advancement in adhesive technology, showcasing his expertise and commitment to the industry.

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