Hideki Hara

Title: Innovations by Inventor Hideki Hara

Introduction

Hideki Hara is a notable inventor based in Utsunomiya, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and reliability of semiconductor element mounting boards.

Latest Patents

One of Hideki Hara's latest patents involves a semiconductor element mounting board that features a unique design. This board includes a semiconductor element mounted on one of its surfaces, with a bonding agent layer that ensures a strong connection. The board is designed with a first layer that embeds the semiconductor element and a second layer on the opposite surface, both made from the same material. Additionally, surface layers are provided on both the first and second layers, enhancing the overall rigidity. The patent specifies that the coefficient of thermal expansion of each surface layer is 40 ppm/°C or lower, ensuring stability under varying temperatures.

Career Highlights

Hideki Hara is currently employed at Sumitomo Bakelite Company Limited, where he continues to innovate in the semiconductor field. His work has been instrumental in developing advanced materials and designs that improve the performance of semiconductor devices.

Collaborations

Throughout his career, Hideki has collaborated with notable colleagues such as Mitsuo Sugino and Toru Meura. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Hideki Hara's contributions to semiconductor technology exemplify the importance of innovation in modern electronics. His patents reflect a commitment to advancing the field and improving the functionality of semiconductor devices.