Company Filing History:
Years Active: 2011
Title: Innovative Contributions of Inventor Hideki Akiniwa
Introduction
Hideki Akiniwa is a notable inventor hailing from Tsuchiura, Japan. With a keen focus on engineering and advancements in pump technology, he has made significant contributions within his field. His expertise and innovative mindset have culminated in the development of a unique pressure test method for double suction volute pumps.
Latest Patents
Hideki Akiniwa holds a patent for the "Pressure test method of double suction volute pump." This invention involves the formation of flat faces along the right and left sides of a rotary shaft, which serve as sealing faces at the circumferential edges of semicircular division plates. These plates define the suction chambers and a discharge chamber within a volute casing that is divided into two segments. The patent details the use of two disc plates as pressure test tools, positioned on either side of the rotary shaft to ensure effective testing and sealing.
Career Highlights
Akiniwa is currently employed at Hitachi Plant Technologies, Ltd., where he applies his skills in the development of advanced pumping solutions. His work emphasizes innovation and quality, contributing to the enhancement of pump operation efficiency within industrial applications.
Collaborations
In his role at Hitachi Plant Technologies, Hideki collaborates with accomplished colleagues such as Tomohiro Naruse and Hiroaki Yoda. These partnerships foster a productive environment that promotes technological advancement and innovative problem-solving.
Conclusion
Hideki Akiniwa's inventive spirit and commitment to engineering excellence have established him as a respected figure in the field of pump technology. His patented pressure test method showcases not only his technical knowledge but also his dedication to fostering innovation in industrial applications. As he continues to work with talented individuals at Hitachi Plant Technologies, the potential for future breakthroughs remains promising.