Nara, Japan

Hideharu Shirai


Average Co-Inventor Count = 2.9

ph-index = 2

Forward Citations = 100(Granted Patents)


Company Filing History:


Years Active: 1986-1988

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2 patents (USPTO):Explore Patents

Title: Innovations of Hideharu Shirai

Introduction

Hideharu Shirai is a notable inventor based in Nara, Japan. He has made significant contributions to the field of materials science, particularly in the development of water-absorbent resins and thermoplastic resin foams. With a total of 2 patents to his name, Shirai continues to push the boundaries of innovation in his industry.

Latest Patents

Shirai's latest patents include a water-absorbent resin and a process for producing the same. This innovative resin is characterized by its crosslinked surface, formed by reacting a powdery water-absorbent resin of polyacrylic acid series with an aluminum compound in the presence of polyhydric alcohol and water. Another significant patent is an apparatus for producing thermoplastic resin foam. This apparatus consists of an extruder, a die member, and a vacuum device connected in series. The vacuum device features a chamber and an air-tight sealing device that ensures the chamber is sealed around the extruded mass of foamed thermoplastic resin.

Career Highlights

Shirai is currently employed at Sekisui Kaseihin Kogyo Kabushiki Kaisha, a company known for its advancements in chemical products. His work has been instrumental in developing new materials that have various applications in different industries.

Collaborations

Throughout his career, Shirai has collaborated with talented individuals such as Yoshifumi Nakahara and Fumito Yamai. These collaborations have fostered a creative environment that has led to innovative solutions and advancements in their respective fields.

Conclusion

Hideharu Shirai's contributions to the field of materials science through his patents and collaborations highlight his role as a significant inventor. His work continues to influence the development of new materials and technologies.

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