Company Filing History:
Years Active: 1987-1996
Title: The Innovations of Hidebumi Ohnuki: A Pioneer in Printed Wiring Board Technology
Introduction
Hidebumi Ohnuki is a distinguished inventor based in Tokyo, Japan, renowned for his contributions to printed wiring board technology. With an impressive portfolio of five patents, Ohnuki continues to innovate in a field that is fundamental to modern electronics.
Latest Patents
One of his latest patents is titled "Method of manufacturing a multilayered printed wiring board." This invention encompasses a multilayered printed wiring board designed with a multitude of inner layer circuits, ground layers, and insulating layers. Notably, the inner layer circuits are arranged parallel to one another within at least one inner layer, allowing for optimal functionality. The design ensures that the ground layers sandwich the inner circuits effectively, while the first insulating layers maintain insulation between the circuits and ground layers. Furthermore, Ohnuki has patented a "Method of and apparatus for plating printed circuit board," which features an innovative apparatus that enhances the plating process of non-through holes in printed circuit boards. This invention achieves the removal of air bubbles in non-through holes by utilizing vibration and pressure reduction, resulting in a superior and reliable electric connection.
Career Highlights
Hidebumi Ohnuki's professional journey is firmly anchored at NEC Corporation, a leading technology company in Japan. Here, he has leveraged his expertise to substantially contribute to advancements in circuit board technology. His patents reflect a deep understanding of the principles of electronic design and manufacturing.
Collaborations
Throughout his career, Ohnuki has collaborated with esteemed colleagues such as Ryo Maniwa and Tutomu Ohshima. These partnerships have encouraged a collaborative environment, fostering innovative ideas and enhancing the quality of their collective work in the field of electronics.
Conclusion
In summary, Hidebumi Ohnuki stands out as a prominent inventor whose work has significantly influenced the industry of printed wiring boards. His latest patents embody a commitment to technological advancement and innovation, positioning him as a key figure at NEC Corporation and in the broader electronics community. As technology continues to evolve, Ohnuki’s contributions will undoubtedly resonate in the future of electronic circuit design.