Company Filing History:
Years Active: 1993-1994
Title: Innovations of Hideaki Okikawa
Introduction
Hideaki Okikawa is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of adhesive technology, particularly with heat-resistant adhesives. His work has implications for various industrial applications, especially in structural and electronic materials.
Latest Patents
Okikawa holds 2 patents, with his latest invention focusing on a heat-resistant adhesive and the method of adhesion using this adhesive. The heat-resistant adhesive comprises polyamic acid and/or polyimide, which are prepared using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component. It also utilizes various tetracarboxylic acid dianhydrides, including 3,3',4,4'-biphenyltetracarboxylic dianhydride and 3,3',4,4'-benzophenonetetracarboxylic dianhydride. This adhesive is designed to adhere under mild temperature and pressure conditions, providing excellent adhesive strength for structural and electronic materials.
Career Highlights
Okikawa is currently associated with Mitsui Toatsu Chemicals, Incorporated, where he continues to innovate in adhesive technologies. His work has been instrumental in advancing the capabilities of heat-resistant adhesives, making them more effective for industrial use.
Collaborations
He has collaborated with notable coworkers, including Shoji Tamai and Katsuaki Iiyama, contributing to the development of advanced adhesive solutions.
Conclusion
Hideaki Okikawa's contributions to adhesive technology, particularly through his innovative patents, highlight his role as a significant inventor in the field. His work continues to impact various industries, showcasing the importance of innovation in material science.