Heung Sop Chun

Title: Heung Sop Chun: Innovator in Semiconductor Packaging

Introduction

Heung Sop Chun is a notable inventor based in Choongchungbook-Do, South Korea. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative methods that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

Heung Sop Chun holds a patent for a "Method of producing semiconductor package having solder balls." This invention discloses a semiconductor package that features solder balls formed on the mold resin body, eliminating the need for outer leads. This design allows for multiple packages to be easily vertically layered, which is essential for increasing memory capacity. The method of producing the package involves forming solder balls through techniques such as screen printing, dotting, electroplating, or vacuum depositing of solder paste. This approach eliminates the typical forming step, achieving a thinner package. Additionally, the design includes multiple holes in the mold resin body that communicate with the inner leads, ensuring that the solder balls are electrically connected through conductors.

Career Highlights

Heung Sop Chun is associated with Goldstar Electron Co., Ltd., where he applies his expertise in semiconductor technology. His work has contributed to advancements in the production and design of semiconductor packages, making them more efficient and compact.

Conclusion

Heung Sop Chun's innovative approach to semiconductor packaging exemplifies the importance of creativity in technology. His patent reflects a significant advancement in the field, showcasing his role as a key inventor in the industry.