Company Filing History:
Years Active: 2012
Title: Heung Se Lee: Innovator in Conductive Particle Technology
Introduction
Heung Se Lee is a notable inventor based in Kyeonggi-do, South Korea. He has made significant contributions to the field of conductive materials, particularly in the development of innovative conductive particles.
Latest Patents
Heung Se Lee holds 1 patent for his invention titled "Conductive particles for anisotropic conductive interconnection." This patent describes a conductive particle that features a conductive nickel/gold (Ni/Au) complex metal layer with a phosphorous content of less than about 1.5 weight percent. This unique design is formed on the surface of a polymer resin particle. The invention aims to achieve high conductivity while ensuring good adhesion of the Ni/Au metal layer to the polymer resin particle. Additionally, the patent includes methods for forming these conductive particles and provides an anisotropic adhesive composition that incorporates them.
Career Highlights
Heung Se Lee is associated with Cheil Industries Inc., where he has been instrumental in advancing research and development in conductive materials. His work has contributed to the company's reputation as a leader in innovative technologies.
Collaborations
Heung Se Lee has collaborated with notable colleagues, including Jung Bae Jun and Jin Gyu Park. Their combined expertise has fostered a productive environment for innovation and development in their field.
Conclusion
Heung Se Lee's contributions to the field of conductive particles exemplify the importance of innovation in technology. His work continues to influence advancements in materials science and engineering.