Herman P Meyer

Title: Innovations of Herman P. Meyer

Introduction

Herman P. Meyer is a notable inventor based in Rifton, NY (US). He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on enhancing thermal transfer and assembly processes in electronic devices.

Latest Patents

One of his latest patents is for a low profile metal-ceramic-metal packaging. This invention features a heat-conductive honeycomb ceramic spacer with an array of apertures. It facilitates the assembly of semiconductor devices that include multiple semiconductor stacks. The design incorporates a low-profile contact made of foil with raised portions that align with the apertures in the ceramic spacer. This allows for effective contact with the semiconductor stacks when sandwiched between the foil and another conductive sheet. Additionally, the invention provides a mechanism for disconnecting defective stacks, with extra stacks included to compensate for any failures, adhering to an n-x design philosophy. Solder preforms may also be utilized to enhance connections to the foil or conductive sheet through reflux.

Another significant patent by Meyer is the ceramic base component packaging assembly. This assembly is designed for high thermal transfer rates and includes a molded plastic cover that accommodates spring washers, ceramic pads, resistive elements, and other electronic components. The thermally conductive ceramic base ensures that electronic elements are pressed against it by the spring washers, promoting efficient thermal transfer. The ceramic base serves as an effective thermal conductor while also acting as an electrical isolator for the device.

Career Highlights

Herman P. Meyer is currently employed at International Business Machines Corporation (IBM). His work at IBM has allowed him to innovate and develop advanced packaging solutions for electronic devices, contributing to the company's reputation for cutting-edge technology.

Collaborations

Meyer has collaborated with notable coworkers such as Robert A. Biamonte and Joseph W. Bogdanski. Their combined expertise has likely fostered an environment of innovation and creativity within their projects.

Conclusion

Herman P. Meyer is a distinguished inventor whose work in semiconductor packaging has led to significant advancements in the field. His patents reflect a commitment to improving thermal management and assembly processes in electronic devices. His contributions continue to influence the industry and enhance the performance of modern technology.