Ballston Lake, NY, United States of America

Herman A Nied


Average Co-Inventor Count = 1.7

ph-index = 8

Forward Citations = 194(Granted Patents)


Company Filing History:


Years Active: 1984-1999

Loading Chart...
15 patents (USPTO):Explore Patents

Title: Innovations of Herman A Nied

Introduction

Herman A Nied is a notable inventor based in Ballston Lake, NY (US). He holds a total of 15 patents, showcasing his significant contributions to the field of engineering and technology. His work primarily focuses on advanced methods for joining materials, particularly in the context of x-ray devices.

Latest Patents

One of his latest patents is a method for connecting a molybdenum-based alloy structure to a more ductile alloy structure. This innovative method involves solid-state bonding techniques, such as inertia-welding or explosive-welding. The molybdenum-based alloy may be a TZM-type material, while the ductile alloy can be tantalum-based, niobium-based, or nickel-based. This method is particularly beneficial in the manufacture of x-ray devices, including rotary anode assemblies. Another significant patent is the electromagnetic field enhanced brazing method. This process improves the brazing of complex joints in large components by utilizing an external electromagnetic field to enhance the flow of molten braze alloy into voids between components.

Career Highlights

Herman A Nied has made substantial contributions during his career at General Electric Company. His innovative approaches have led to advancements in material joining techniques, which are crucial for various applications in technology and manufacturing.

Collaborations

Throughout his career, he has collaborated with notable colleagues, including Robert E Sundell and Marshall Gordon Jones. These collaborations have further enriched his work and contributed to the development of new technologies.

Conclusion

Herman A Nied's innovative work and numerous patents reflect his expertise and dedication to advancing engineering solutions. His contributions, particularly in the field of material joining, continue to impact the technology landscape significantly.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…