Livonia, MI, United States of America

Henry Hengzhi Yang


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Henry Hengzhi Yang: Innovator in Electrical Connectors

Introduction

Henry Hengzhi Yang is a notable inventor based in Livonia, MI (US). He has made significant contributions to the field of electrical engineering, particularly in the design of electrical connectors. His innovative approach has led to the development of a unique patent that enhances the functionality and efficiency of electrical connections.

Latest Patents

Henry Hengzhi Yang holds a patent for an electrical connector. This invention includes a plurality of connector units, each featuring a base, a first pin, a second pin, and a soldering pad. The connector units can be linked together to form an array by using bridges that connect the bases of successive units. The bases are embedded in a plastic carrier material, allowing for a streamlined design. The configuration of the soldering pads and ports enables them to be soldered to a printed circuit board, resulting in two rows of electrically independent pins. A housing is also utilized to protect the circuit board from external forces applied to the pins. This innovative design simplifies the assembly process and improves the reliability of electrical connections.

Career Highlights

Henry is currently employed at Danlaw, Inc., where he continues to work on advancing electrical connector technology. His expertise and innovative mindset have made him a valuable asset to the company.

Collaborations

Henry collaborates with his coworker, Eugenijus Sumskas, to further enhance their projects and drive innovation within their field.

Conclusion

Henry Hengzhi Yang's contributions to electrical connector technology demonstrate his commitment to innovation and excellence. His patent reflects a significant advancement in the industry, showcasing his ability to solve complex engineering challenges.

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