Aachen, Germany

Henning Hofius

USPTO Granted Patents = 2 

 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021-2024

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2 patents (USPTO):Explore Patents

Title: Henning Hofius: Innovator in Thermal Conductivity Composites

Introduction

Henning Hofius is a notable inventor based in Aachen, Germany. He has made significant contributions to the field of materials science, particularly in the development of alumina products for polymer compositions. With a total of two patents to his name, Hofius is recognized for his innovative approaches to enhancing thermal conductivity in composite materials.

Latest Patents

Hofius's latest patents focus on alumina products and their applications in polymer compositions with high thermal conductivity. These patents describe alumina products that contain both fine and coarse particle size components, featuring specific particle size characteristics and irregular, non-spherical shapes. The disclosed alumina products can be utilized in polymer formulations to create composites that exhibit high isotropic thermal conductivity, making them valuable in various industrial applications.

Career Highlights

Henning Hofius is currently employed at Martinswerk GmbH, where he continues to advance his research and development efforts. His work at Martinswerk GmbH has positioned him as a key player in the field of thermal conductivity materials, contributing to the company's reputation for innovation.

Collaborations

Hofius has collaborated with several professionals in his field, including Bashar Diar Bakerly and Martijn Jacobus Marinus Mies. These collaborations have fostered a productive environment for innovation and have led to the successful development of new materials.

Conclusion

Henning Hofius is a distinguished inventor whose work in alumina products and polymer compositions has made a significant impact on the field of materials science. His contributions continue to pave the way for advancements in thermal conductivity applications.

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