Singapore, Singapore

Hengyun Zhang

USPTO Granted Patents = 1 

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 61(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Innovator Hengyun Zhang: Pioneering Fluid-based Cooling Solutions in Singapore

Introduction: Hengyun Zhang is a prominent inventor based in Singapore, recognized for his significant contributions to the field of thermal management technologies. With a singular yet impactful patent to his name, he has showcased innovative thinking that addresses the challenges associated with heat generation in electronic devices.

Latest Patents: Hengyun Zhang holds a patent for an "Apparatus and method for fluid-based cooling of heat-generating devices." This invention involves a method and apparatus designed for effective cooling of devices that generate heat. In this innovative setup, a heat-generating device is strategically mounted on a carrier, creating a channel through which a non-conductive cooling fluid circulates. This fluid enters through an inlet, flows through the channel, absorbs heat, and exits via an outlet, thus enhancing the cooling efficiency of the heat-generating device and its carrier.

Career Highlights: Currently, Hengyun Zhang is associated with the Institute of Microelectronics, where he applies his expertise in microelectronics and thermal management. His role involves not only innovation but also the practical application of his inventions to improve electronic device reliability and performance.

Collaborations: Throughout his career, Hengyun Zhang has collaborated with talented individuals in his field, including coworkers Damaruganath Pinjala and Vaidyanathan Kripesh. These collaborations have fostered an environment of creativity and innovation, further propelling advancements in heat management solutions.

Conclusion: Hengyun Zhang exemplifies the spirit of innovation and invention in Singapore's technology landscape. His patent on fluid-based cooling methods represents a crucial step toward improving heat management in electronic devices. As he continues to work alongside esteemed peers at the Institute of Microelectronics, the future looks bright for further innovations from this talented inventor.

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