Heng-Min Liu

Title: Heng-Min Liu: Innovator in Shock Absorbing Technology

Heng-Min Liu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronic device design, particularly in the area of shock absorption. His innovative approach has led to the development of a unique patent that enhances the durability of electronic devices.

Latest Patents

Heng-Min Liu holds a patent for a "Shock absorbing structure adapted for a circuit board of an electronic device and electronic device therewith." This invention features a shock absorbing structure that includes at least one protruding column and at least one resilient module. The protruding column is fixed on an electronic device and passes through the circuit board. The resilient module is positioned between the protruding column and the circuit board. When the electronic device experiences an external shock load, the resilient module deforms, generating a resilient force. Once the shock is removed, the resilient force allows the circuit board to recover, thereby enhancing the device's longevity.

Career Highlights

Heng-Min Liu is currently employed at Wistron Corporation, a leading company in the electronics manufacturing sector. His work at Wistron has allowed him to apply his innovative ideas in practical applications, contributing to the advancement of electronic device technology.

Collaborations

Heng-Min Liu has collaborated with talented coworkers such as Chun-Wang Lin and Chin-Chung Hung. Their combined expertise has fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Heng-Min Liu is a distinguished inventor whose work in shock absorbing technology has the potential to significantly improve the durability of electronic devices. His contributions to the field are noteworthy, and his patent reflects his commitment to innovation.