Company Filing History:
Years Active: 1991
Title: Hendrik F Van Den Berg: Innovator in Bonding Technologies
Introduction
Hendrik F Van Den Berg is a notable inventor based in Eindhoven, Netherlands. He has made significant contributions to the field of bonding technologies, particularly through his innovative methods involving silicon oxide.
Latest Patents
Van Den Berg holds a patent for a method of bonding together two bodies with silicon oxide. This method involves providing a first body with a flat surface and a second body with a silicon oxide layer, also featuring a flat surface. A connecting layer containing boron is applied to at least one of the flat surfaces. The two bodies are then pressed together at elevated temperatures, resulting in the formation of a borosilicate glass layer. The use of a layer of practically pure boron as the connecting layer allows for precise control over the composition of the borosilicate glass layer based on the chosen layer thicknesses.
Career Highlights
Hendrik F Van Den Berg is associated with U.S. Philips Corporation, where he has been able to apply his expertise in bonding technologies. His work has contributed to advancements in various applications that require strong and reliable bonding solutions.
Collaborations
Some of his notable coworkers include Jan Haisma and Gijsbertus A Spierings, who have collaborated with him on various projects within the field.
Conclusion
Hendrik F Van Den Berg's innovative approach to bonding technologies has led to significant advancements in the field. His patent demonstrates the potential for improved bonding methods that can enhance the performance of materials in various applications.