Company Filing History:
Years Active: 2003
Title: Innovations by Heinz Ritzmann in Semiconductor Encapsulation
Introduction
Heinz Ritzmann is a notable inventor based in Berg, Switzerland. He has made significant contributions to the field of semiconductor technology, particularly in the encapsulation of electronic components. His innovative approach addresses critical challenges in the industry, showcasing his expertise and dedication to advancing technology.
Latest Patents
Heinz Ritzmann holds a patent for a "Method and device for encapsulating an electronic component, in particular a semiconductor chip." This invention involves fastening the component at a distance onto a flat substrate. An elastomer layer is deposited on the substrate to compensate for differing thermal expansion coefficients between the substrate and the component. The process includes depositing a buffer material and/or adhesive in liquid or pasty form from a dispenser, placing the component onto this material at room temperature, and subjecting it to precuring before final curing. The component is then connected to contact locations on the substrate via electrical leads, followed by encasing all remaining hollow spaces, including the electrical leads, with a protective mass. This patent highlights his innovative approach to improving the reliability and performance of semiconductor devices.
Career Highlights
Heinz Ritzmann has had a successful career, working with Alphasem AG, a company known for its advancements in semiconductor manufacturing technology. His work has contributed to the development of more efficient and reliable electronic components, making a lasting impact on the industry.
Collaborations
Heinz has collaborated with notable colleagues such as Gustav Wirz and Wolfgang Herbst. Their combined expertise has fostered innovation and development in semiconductor technology.
Conclusion
Heinz Ritzmann's contributions to the field of semiconductor encapsulation demonstrate his commitment to innovation and excellence. His patent reflects a significant advancement in the technology, ensuring better performance and reliability for electronic components.