Merchweiler, Germany

Heinz Müller


Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2002-2004

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2 patents (USPTO):

Title: Innovations by Inventor Heinz Müller

Introduction

Heinz Müller is a notable inventor based in Merchweiler, Germany. He has made significant contributions to the field of materials science, particularly in the development of active brazing solders for alumina-ceramic parts. With a total of 2 patents, his work has advanced the capabilities of ceramic bonding technologies.

Latest Patents

Müller's latest patents focus on an active brazing solder specifically designed for brazing high-purity alumina ceramic parts. This innovative solder contains a maximum of 12 wt. % titanium, a maximum of 8 wt. % beryllium, and less than 16.5 wt. % iron, with the remainder being zirconium and any impurities. The solder exhibits several remarkable features, including a brazing temperature lower than 1,000 °C, high-vacuum-tight joints over extended periods, and a coefficient of thermal expansion that closely matches that of alumina ceramics throughout the brazing process. The strength of the brazed joint is so robust that fractures occur in the adjacent ceramic rather than at the joint itself. Additionally, the pressure resistance of the solder exceeds 2 GPa, and it can be processed into powders with particle sizes around 10 µm.

Career Highlights

Throughout his career, Heinz Müller has worked with reputable companies, including Endress + Hauser GmbH & Co. His expertise in materials science and engineering has allowed him to make significant advancements in the field.

Collaborations

Müller has collaborated with various professionals, including Frank Hegner and Elke Maria Schmidt, contributing to the success of his projects and innovations.

Conclusion

Heinz Müller is a distinguished inventor whose work in active brazing solders has made a lasting impact on the ceramics industry. His innovative solutions continue to enhance the performance and reliability of ceramic bonding technologies.

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