Location History:
- Duesseldorf, DE (2024)
- Dusseldorf, DE (2024)
Company Filing History:
Years Active: 2024
Title: Heike Klein: Innovator in Composite Packaging Solutions
Introduction
Heike Klein is a notable inventor based in Düsseldorf, Germany. She has made significant contributions to the field of packaging through her innovative designs and materials. With a total of four patents to her name, Klein has focused on creating solutions that enhance the functionality and efficiency of packaging.
Latest Patents
Klein's latest patents include a flat-shaped composite material designed for manufacturing packages. This material consists of a polymer outer layer, a polymer inner layer, and a fibrous support layer. The design features multiple fold lines that allow for the creation of closed packages by folding the material and connecting seam surfaces. Additionally, her patent for a package sleeve made from composite material introduces a design that accommodates complex geometries while maintaining package rigidity. Another significant patent involves a package with stress-relief panels, which enables the production of packages with intricate shapes without compromising structural integrity.
Career Highlights
Throughout her career, Heike Klein has worked with prominent companies such as SIG Technology AG and SIG Services AG. Her experience in these organizations has allowed her to refine her skills in packaging technology and innovation. Klein's work has been instrumental in advancing the capabilities of composite materials in the packaging industry.
Collaborations
Klein has collaborated with talented individuals in her field, including Norman Gierow and Ali Kaylan. These partnerships have fostered a creative environment that encourages