Hayden M Leedy

Title: Innovations of Hayden M. Leedy in Ion Beam Micromachining

Introduction

Hayden M. Leedy is a notable inventor recognized for his contributions to the field of micromachining. He is based in Thousand Oaks, California, and has made significant advancements in the production of millimeter-wave electronic devices. His innovative approach utilizes ion beam micromachining methods to achieve precise results in semiconductor fabrication.

Latest Patents

Leedy holds a patent for an "Ion beam micromachining method." This patent describes a process where an epitaxial layer on a substrate wafer is micromachined to a precise thickness by directing an ion beam over the layer. The method includes removing any bombardment damage through a light chemical etch and placing an insulative layer with a mask over the micromachined layer. The ion beam is then directed onto the masked wafer to micromachine precise holes through the unmasked portions of the insulative layer. This innovative technique allows for the precise thinning of the epitaxial layer and can even etch into the semiconductor to alter electric field lines at the interface.

Career Highlights

Leedy has worked at Hughes Aircraft Company, where he has applied his expertise in micromachining to develop advanced electronic devices. His work has contributed to the enhancement of technologies that rely on precise semiconductor fabrication.

Collaborations

Throughout his career, Leedy has collaborated with notable colleagues such as Hugh L. Garvin and Richard S. Iwasaki. These collaborations have likely fostered an environment of innovation and shared knowledge in the field of micromachining.

Conclusion

Hayden M. Leedy's contributions to ion beam micromachining represent a significant advancement in semiconductor technology. His innovative methods continue to influence the production of millimeter-wave electronic devices, showcasing the importance of precision in modern engineering.