Hyogo, Japan

Haruo Tetsuno


Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 32(Granted Patents)


Company Filing History:


Years Active: 1986-1987

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Haruo Tetsuno: Innovator in Boiling Cooling Technology

Introduction

Haruo Tetsuno is a notable inventor based in Hyogo, Japan. He has made significant contributions to the field of cooling technology, particularly with his innovative boiling cooling apparatus. With a total of 2 patents to his name, Tetsuno's work exemplifies the intersection of engineering and practical application.

Latest Patents

Tetsuno's latest invention, the boiling cooling apparatus, is designed to enhance the efficiency of heat transfer in cooling systems. This apparatus consists of a heat-generating device that is fully immersed in a liquid coolant within a sealed container. The design includes vertically extending passages through which ascending bubbles, formed by heat transfer, create an upward current flow. Additionally, the apparatus features current flow control plates that redirect the upward flow of coolant laterally and downwardly, promoting convection cooling. This cyclic flow of cooling liquid is crucial for maintaining optimal temperatures in various applications.

Career Highlights

Haruo Tetsuno is associated with Mitsubishi Denki Kabushiki Kaisha, a leading company in the technology sector. His work there has allowed him to focus on innovative cooling solutions that address modern engineering challenges. Tetsuno's inventions have not only advanced the field but have also contributed to the efficiency of various industrial processes.

Collaborations

Throughout his career, Tetsuno has collaborated with esteemed colleagues such as Masao Fujii and Kazushige Nakao. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Haruo Tetsuno's contributions to boiling cooling technology highlight his role as an influential inventor in Japan. His innovative designs and collaborative efforts continue to shape the future of cooling systems.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…