Hyogo, Japan

Haruhisa Fujii


Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 18(Granted Patents)


Location History:

  • Hyogo, JP (1991)
  • Tokyo, JP (1999)

Company Filing History:


Years Active: 1991-1999

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2 patents (USPTO):Explore Patents

Title: Haruhisa Fujii: Innovator in Circuit Board Technology and Ion Implantation

Introduction

Haruhisa Fujii is a notable inventor based in Hyogo, Japan, recognized for his contributions to circuit board technology and ion implantation. With a total of 2 patents, Fujii has made significant advancements in the field, showcasing his expertise and innovative spirit.

Latest Patents

Fujii's latest patents include a circuit board designed with a conductor layer for increased breakdown voltage. This innovative circuit board features an insulating substrate with first and second conductive layers, enhancing its performance and reliability. Another significant invention is his ion implanter, which utilizes a sample table and magnetic field applying means to improve the efficiency of ion injection into samples. This technology effectively reduces electrostatic charge on the sample surface, preventing device defects caused by electrostatic discharge damage.

Career Highlights

Fujii is currently employed at Mitsubishi Electric Corporation, where he continues to develop cutting-edge technologies. His work has contributed to advancements in electronic components and semiconductor manufacturing, making a lasting impact on the industry.

Collaborations

Fujii has collaborated with esteemed colleagues such as Hirotaka Muto and Toshinori Kimura, further enhancing the innovative environment at Mitsubishi Electric Corporation.

Conclusion

Haruhisa Fujii's contributions to circuit board technology and ion implantation demonstrate his commitment to innovation and excellence in engineering. His patents reflect a deep understanding of the challenges in the field and a dedication to developing solutions that advance technology.

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