Hao-Pai Lee

Title: Hao-Pai Lee: Innovator in Multi-Chip Packaging Technology

Introduction

Hao-Pai Lee is a notable inventor based in Zhudong, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly in multi-chip systems. His innovative approach has led to advancements that enhance the functionality and efficiency of electronic devices.

Latest Patents

Hao-Pai Lee holds a patent for a "Multi-chips in system level and wafer level package structure." This invention includes a package substrate with multiple through holes, accommodating multi-chips of varying functions and sizes. The design incorporates metal wires, a package body, and conductive components. The multi-chips are strategically combined with the package substrate, allowing their pads to be exposed through the holes. These pads are electrically connected to adjacent connecting terminals using conductive wires. The package material fills the through holes, encapsulating the conductive wires and active surfaces of the multi-chips, thereby achieving a sophisticated multi-chip packaging solution.

Career Highlights

Hao-Pai Lee is currently associated with Gainia Intellectual Asset Services, Inc., where he continues to innovate in the field of intellectual property and semiconductor technology. His work has been instrumental in developing advanced packaging solutions that cater to the growing demands of the electronics industry.

Collaborations

Hao-Pai Lee collaborates with Shih-Chi Chen, contributing to various projects that focus on enhancing semiconductor technologies and packaging methods.

Conclusion

Hao-Pai Lee's contributions to multi-chip packaging technology exemplify his innovative spirit and dedication to advancing the field. His patent reflects a significant step forward in semiconductor design, showcasing the potential for improved electronic device performance.