Hao Dai

Title: Hao Dai - Innovator in Automatic Sandwich Packaging Technology

Introduction

Hao Dai is a notable inventor based in Nantong, China. He has made significant contributions to the field of food packaging technology, particularly with his innovative designs aimed at improving efficiency in sandwich production.

Latest Patents

Hao Dai holds a patent for a "Bread slice delivery device for automatic sandwich packaging machine." This device is designed to ensure that bread slices are delivered accurately during the sandwich-making process. The invention consists of a base plate, a bread receptacle base, a bread receptacle, three ball screw-type linear slide platforms, three L-shaped brackets, a rectangular push plate, two flat carrier plates, one photoelectric switch, and six proximity switches. This technology ensures that bread slices land precisely and that sandwich layers remain aligned throughout the delivery process. Additionally, the bread storage receptacle can be easily swapped out, enhancing the device's usability.

Career Highlights

Hao Dai is affiliated with Nantong University, where he continues to work on innovative projects that advance food packaging technology. His dedication to research and development has positioned him as a key figure in his field.

Collaborations

Hao Dai collaborates with talented colleagues, including Liang Hua and Yusong Zhou, who contribute to his projects and research endeavors.

Conclusion

Hao Dai's innovative work in automatic sandwich packaging technology exemplifies the impact of creativity and engineering in the food industry. His contributions are paving the way for more efficient food production methods.