Company Filing History:
1 out of 45 
1 out of 1,678 Years Active: 2001-2003
Title: The Innovations of Hans-Willi Losensky
Introduction
Hans-Willi Losensky is a notable inventor based in Marl, Germany. He has made significant contributions to the field of adhesive technology, holding 2 patents that showcase his innovative approaches. His work primarily focuses on electrostatic coating processes and crosslinkable adhesive compositions.
Latest Patents
One of his latest patents is titled "Electrostatic coating of moldings with thermoplastic and crosslinkable copolyamide hot-melt adhesives." This process describes how a nonconductive molding can be electrostatically coated with a thermoplastic or crosslinkable copolyamide hot-melt adhesive. The hot-melt adhesive can be utilized as a fine powder with a particle size ranging from 1 to 200 µm and a melting point of up to 160°C. Another significant patent is "Crosslinking base layer for bondable interlinings in accordance with the double dot tech technique." This invention involves a crosslinkable hot-melt adhesive composition that includes a reactive powder mixed with a crosslinking component. The components do not react until the mixture is melted, making it useful for coating and/or lamination of sheet-like structures.
Career Highlights
Throughout his career, Hans-Willi Losensky has worked with prominent companies such as Degussa-Huels Aktiengesellschaft and Degussa Aktiengesellschaft. His experience in these organizations has allowed him to develop and refine his innovative ideas in adhesive technology.
Collaborations
Some of his notable coworkers include Ulrich Simon and Thorsten Gurke. Their collaboration has likely contributed to the advancements in the projects they have worked on together.
Conclusion
Hans-Willi Losensky's contributions to adhesive technology through his patents reflect his innovative spirit and dedication to the field. His work continues to influence the industry and inspire future advancements.