Company Filing History:
Years Active: 1985-1989
Title: Innovations by Hans J Trumpp in Adhesive Metal Layer Technology
Introduction
Hans J Trumpp, based in Stuttgart, Germany, is a prolific inventor recognized for his contributions to the field of synthetic substrates and metallization techniques. With a total of four patents to his name, Trumpp has demonstrated expertise in enhancing the adhesion of metal layers, which is crucial for various applications in electronics and material science.
Latest Patents
Among his noteworthy innovations, Trumpp has developed a unique method concerning synthetic substrates with adhesive metal layers. One of his latest patents describes a sophisticated technique that significantly improves adhesion between a synthetic substrate and the metallized layers deposited on it. The process involves spin-coating a glass resin layer onto an epoxide substrate, followed by the application of a photoresist layer that undergoes reactive ion etching to create a roughened contour.
This roughened pattern facilitates the formation of perforations in the glass layer through further etching, producing recesses with overhanging walls in the substrate. Subsequently, a thin copper layer is sputtered onto the substrate, with additional copper conductors filling the recesses. This clever design results in mortices and tenons, allowing for exceptional adhesion levels between the substrate and the metallized layers, reaching approximately 1000 n/m.
Career Highlights
Trumpp's career is predominantly marked by his engagement with International Business Machines Corporation (IBM), where he has applied his innovative ideas to real-world applications. His work has positioned him as a leader in material adhesion technologies, impacting various sectors in engineering.
Collaborations
Throughout his career, Hans J Trumpp has had the privilege of collaborating with esteemed colleagues such as Johann Greschner and Friedrich W Schwerdt. These partnerships have enhanced his research and development efforts, contributing to the strength and applicability of his patented technologies in the industry.
Conclusion
Hans J Trumpp's contributions in the realm of adhesive metal layers on synthetic substrates signify a substantial advancement in materials engineering. His latest patents not only underline his innovative capabilities but also highlight the importance of collaboration in technological advancements. As the field continues to evolve, Trumpp’s work remains pivotal in bridging the gap between synthetic materials and metallization processes.