Company Filing History:
Years Active: 1987-1990
Title: Innovations of Hans-Dieter Kilthau
Introduction
Hans-Dieter Kilthau is a notable inventor based in Munich, Germany. He has made significant contributions to the field of electroless plating, particularly in the control of dissolved oxygen levels during the plating process. With a total of 2 patents, his work has advanced the efficiency and effectiveness of copper plating systems.
Latest Patents
Kilthau's latest patents focus on electroless plating with bi-level control of dissolved oxygen. This innovative approach minimizes nodule formation in a continuous electroless copper plating system by independently controlling the dissolved oxygen contents in both the plating solution and the associated external piping. The method ensures that the level of dissolved oxygen in the plating tank is maintained at an optimal value for satisfactory plating. As the plating solution exits the tank, additional oxygen gas is introduced to prevent plating in the external piping, allowing copper to be etched or dissolved back into the solution. At the end of the external piping, the dissolved oxygen level is reduced to maintain the necessary conditions for effective plating in the tank.
Career Highlights
Kilthau is currently associated with the International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to explore and develop innovative solutions in the field of plating technology. His contributions have been instrumental in enhancing the quality and reliability of electroless plating processes.
Collaborations
Throughout his career, Kilthau has collaborated with esteemed colleagues such as Edmond Otto Fey and Peter Haselbauer. These collaborations have fostered a productive environment for innovation and have led to advancements in their respective fields.
Conclusion
Hans-Dieter Kilthau's contributions to electroless plating technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in plating processes, and his work continues to influence the industry positively.