Hang Jiang

Title: **Innovative Contributions of Hang Jiang in Integrated Circuit Packaging**

Introduction

Hang Jiang, a prominent inventor based in Milpitas, California, has made significant strides in the field of integrated circuit packaging. With two patents to her name, she continues to push the boundaries of technological innovation, especially in relation to micro filled via materials.

Latest Patents

Her latest patent focuses on a ball grid array structure and method for packaging an integrated circuit. This innovative design features an integrated circuit package substrate that includes a dielectric layer along with a micro filled via at the center of a hole within that layer. The substrate is equipped with at least one chip bonding pad and one ball attach pad, which are electrically connected by the micro filled via. The unique aspect of the micro filled via material lies in its composition, involving a binding material that can be either conductive or non-conductive, and optionally includes up to 90% by volume of conductive particles like copper or gold. This design allows for the formation of electrical conductors through contact between adjacent conductive particles. Furthermore, an optional programming step can be applied to enhance the performance of the electrical conductor, which can be executed in a cavity up or cavity down configuration.

Career Highlights

Hang Jiang has established herself in the tech industry through her role at Prolinx Labs Corporation, where her expertise in integrated circuit technology is recognized and valued. Her contributions significantly enhance the company's capabilities in semiconductor packaging, making her a key player in their innovation efforts.

Collaborations

In her professional journey, Hang Jiang collaborates with industry experts such as James J Lan and Steve S Chiang. These partnerships highlight her commitment to teamwork and innovation, fostering a collaborative environment that leads to groundbreaking advances in technology.

Conclusion

Through her inventive spirit and commitment to excellence, Hang Jiang continues to make impactful contributions to the field of integrated circuit packaging. Her work not only enhances the efficiency of electronics but also exemplifies the innovative potential of dedicated inventors in today's technological landscape.