Nagano Pref., Japan

Hajime Kaneko


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Hajime Kaneko: Innovator in Friction Filler Welding

Introduction

Hajime Kaneko is a notable inventor based in Nagano Prefecture, Japan. He has made significant contributions to the field of welding technology, particularly through his innovative approach to friction filler welding. His work has implications for various industries that require strong and reliable joining methods.

Latest Patents

Hajime Kaneko holds a patent for a method of friction filler welding. This technique involves providing at least two workpieces and arranging an intermediate member as a filler between the opposed end faces of the workpieces. The workpieces are pressed against each other via the intermediate member to produce friction pressure while rotating or vibrating the intermediate member at high speed. Once the rotation or vibration is halted, each workpiece is upset to the intermediate member, allowing for easy and secure joining without defects. This innovative method enhances the efficiency and reliability of welding processes.

Career Highlights

Hajime Kaneko is affiliated with Nagoya University, where he continues to advance his research and development in welding technologies. His academic background and practical experience have positioned him as a key figure in the field.

Collaborations

Hajime Kaneko collaborates with Takeshi Shinoda, a fellow researcher. Their partnership has fostered advancements in welding techniques and has contributed to the academic community's understanding of friction welding processes.

Conclusion

Hajime Kaneko's contributions to friction filler welding exemplify the importance of innovation in manufacturing technologies. His patent and ongoing research at Nagoya University highlight his commitment to improving welding methods, ensuring stronger and more reliable connections in various applications.

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