Haitao Shi

Title: Haitao Shi - Innovator in Integrated Package Structures

Introduction

Haitao Shi is a prominent inventor based in Wuxi, China. He has made significant contributions to the field of integrated package structures, holding a total of 2 patents. His work focuses on enhancing the efficiency and functionality of electronic packaging.

Latest Patents

Haitao Shi's latest patents include an integrated package structure and a dual-substrate antenna package structure. The integrated package structure involves a main substrate that supports stacked modules and a large-size device, allowing for high-density and miniaturized designs. This innovation addresses the growing demand for advanced layout designs in integrated packaging. The dual-substrate antenna package structure features a main substrate with an antenna substrate connected via solder balls, ensuring stability during manufacturing processes. This design enhances the reliability of antenna packages in various applications.

Career Highlights

Haitao Shi is associated with Jcet Group Co., Ltd., where he continues to develop innovative solutions in electronic packaging. His expertise in integrated structures has positioned him as a key player in the industry.

Collaborations

Haitao has collaborated with notable coworkers, including Shuo Liu and Yaojian Lin, contributing to the advancement of technology in their field.

Conclusion

Haitao Shi's contributions to integrated package structures demonstrate his commitment to innovation and excellence in electronic design. His patents reflect a deep understanding of the industry's needs and a drive to push the boundaries of technology.