Haibing (Robin) Liu

Title: Haibing (Robin) Liu: Innovator in Multi-Chip Package Technology

Introduction

Haibing (Robin) Liu is a notable inventor based in Fremont, California. He has made significant contributions to the field of electronic circuit design, particularly through his innovative patent related to multi-chip package modules. His work is instrumental in advancing the technology used in electronic devices.

Latest Patents

Liu holds a patent for a "Multi-chip package module and a doped polysilicon trench for isolation and connection." This patent describes a circuit module that includes a die attach pad with a surface surrounded by a plurality of leads. The design incorporates a nonconductive adhesive on the surface, allowing multiple electronic circuit dies to be attached. Each die features bonding pads that facilitate connections between different circuit elements. Notably, one of the dies contains a vertical circuit element, with a doped layer forming a terminal along its bottom surface. The trench filled with doped polysilicon serves both to connect to the terminal and to isolate different circuit elements, showcasing Liu's innovative approach to circuit design.

Career Highlights

Liu is currently employed at Microchip Technology Inc., where he continues to develop cutting-edge technologies in the electronics sector. His expertise in circuit design and packaging has positioned him as a valuable asset to his company and the industry at large.

Collaborations

Throughout his career, Liu has collaborated with esteemed colleagues such as Benedict C K Choy and Ching Chu. These partnerships have fostered an environment of innovation and creativity, contributing to the advancement of technology in their field.

Conclusion

Haibing (Robin) Liu is a distinguished inventor whose work in multi-chip package technology has made a significant impact on the electronics industry. His innovative patent and collaborations highlight his commitment to advancing technology and improving electronic circuit design.