Company Filing History:
Years Active: 2011
Title: Gye-An Lee: Innovator in Semiconductor Technology
Introduction
Gye-An Lee is a notable inventor based in Robins, Iowa, who has made significant contributions to the field of semiconductor technology. With a focus on innovative packaging solutions, Lee has developed a unique approach that enhances the functionality of semiconductor devices.
Latest Patents
Gye-An Lee holds 1 patent for his invention titled "Overmolded semiconductor package with an integrated antenna." This patent describes an exemplary embodiment of an overmolded semiconductor package that includes at least one semiconductor die situated over a package substrate. The design features a mold compound overlying the semiconductor die and the substrate, along with a conductive layer on the outer surface of the mold compound. An antenna feed line is integrated within the mold compound, providing an antenna input on the outer surface, which enhances the device's capabilities.
Career Highlights
Lee is currently employed at Skyworks Solutions, Inc., where he continues to push the boundaries of semiconductor technology. His work focuses on developing advanced packaging solutions that improve the performance and efficiency of electronic devices.
Collaborations
Gye-An Lee collaborates with Thomas E Noll, a fellow innovator in the field. Their combined expertise contributes to the advancement of semiconductor technologies and the development of innovative solutions.
Conclusion
Gye-An Lee's contributions to semiconductor technology, particularly through his patented innovations, highlight his role as a key figure in the industry. His work at Skyworks Solutions, Inc. continues to influence the future of electronic device design and functionality.