Guo-Shau Luo

Title: Guo-Shau Luo: Innovator in Package Structure Technology

Introduction

Guo-Shau Luo is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of package structure technology, showcasing his innovative spirit through his patented inventions. His work is particularly relevant in the electronics industry, where efficient packaging solutions are crucial.

Latest Patents

Guo-Shau Luo holds a patent for a "Package structure and method of forming the same." This invention presents a package structure that includes a first redistribution structure and a second redistribution structure. The first redistribution structure consists of a first dielectric layer and a first redistribution circuit within that layer. The second redistribution structure features a first portion on the first redistribution structure and a second portion on the first portion, with each portion electrically connected to the respective structures. Notably, the circuit density of the second portion is lower than that of the first portion. The first portion includes a second dielectric layer containing a second redistribution circuit, while the second portion comprises a third dielectric layer with a third redistribution circuit. The third dielectric layer is equipped with a stiffener layer, which is separated from the third redistribution circuit by the third dielectric layer. Additionally, a method of forming this package structure is also provided.

Career Highlights

Guo-Shau Luo is associated with Nan Ya Printed Circuit Board Corporation, where he applies his expertise in developing advanced packaging solutions. His innovative approach has led to the creation of technologies that enhance the performance and reliability of electronic devices.

Collaborations

Throughout his career, Guo-Shau Luo has collaborated with talented individuals such as Chin-Yi Chuang and Shing-Fun Ho. These collaborations have contributed to the advancement of technology in the field of printed circuit boards.

Conclusion

Guo-Shau Luo's contributions to package structure technology exemplify his innovative mindset and dedication to improving electronic packaging solutions. His patent reflects a significant advancement in the industry, showcasing the importance of innovation in technology.