Hsinchu, Taiwan

Guan-Ting Lai


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Innovations of Guan-Ting Lai in Material Stress Quantification

Introduction

Guan-Ting Lai is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of material science, particularly in the quantification of stress in materials. His innovative approach has led to the development of a unique apparatus that addresses complex challenges in material testing.

Latest Patents

Guan-Ting Lai holds a patent for an "Apparatus for quantifying unknown stress and residual stress of a material and method thereof." This invention focuses on an apparatus designed to quantify unknown stress and residual stress in birefringent or temporarily birefringent materials. The apparatus includes a light source, a polarizer, a first quarter-wave plate, a standard material, a second quarter-wave plate, an analyzer, a loading unit, a spectrometer, and a detecting module. This comprehensive setup allows for the analysis of the transmissivity spectrum of the material being tested, leading to the formulation of a stress quantifying formula for the standard material. He has 1 patent to his name.

Career Highlights

Guan-Ting Lai is affiliated with Tsinghua University, where he continues to engage in research and development in material science. His work has garnered attention for its practical applications in various industries, enhancing the understanding of material properties under stress.

Collaborations

Guan-Ting Lai has collaborated with esteemed colleagues such as Wei-Chung Wang and Chi-Hung Huang. Their combined expertise has contributed to advancements in the field and the successful development of innovative solutions.

Conclusion

Guan-Ting Lai's contributions to material stress quantification exemplify the importance of innovation in science and technology. His patented apparatus represents a significant advancement in the ability to analyze and understand material properties, paving the way for future research and applications.

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