Glenn O Dearing

Title: Glenn O Dearing: Innovator in High-Performance Chip Packaging

Introduction

Glenn O Dearing is a notable inventor based in Endicott, NY (US). He has made significant contributions to the field of chip packaging, holding a total of 3 patents. His work focuses on enhancing the performance and reliability of electronic components.

Latest Patents

Dearing's latest patents include innovative methods for packaging high-performance chips. One of his patents describes a chip carrier package that features a cover plate attached to a stiffener using a reflowable bonding material. This design may also incorporate a thermally and electrically conductive bonding material between the cover plate and the chip itself. Additionally, his patent outlines a chip package that includes an alignment device to ensure proper alignment of the cover plate on the stiffener. Another aspect of his work involves a method of packaging a chip that utilizes a reflowable material between the cover plate and the stiffener body, allowing for simultaneous attachment of the cover plate to the stiffener and the carrier to an electronic circuit board.

Career Highlights

Glenn O Dearing is currently employed at International Business Machines Corporation (IBM), where he continues to innovate in the field of chip packaging. His expertise and inventions have contributed to advancements in electronic component design and manufacturing.

Collaborations

Throughout his career, Dearing has collaborated with notable colleagues, including Timothy F Carden and Kishor V Desai. These partnerships have fostered a collaborative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Glenn O Dearing's contributions to high-performance chip packaging have made a significant impact in the electronics industry. His innovative patents and collaborations reflect his dedication to advancing technology and improving product performance.