Glenn E Gold

Title: Innovations by Inventor Glenn E. Gold

Introduction

Glenn E. Gold is an accomplished inventor based in Lauderhill, Florida, recognized for his contributions in the field of integrated circuit packaging. With a total of four patents to his name, Gold has made significant advancements that enhance the performance and reliability of semiconductor devices.

Latest Patents

One of Gold's notable inventions is the "Moisture Enhanced Ball Grid Array Package." This innovative integrated circuit package comprises a semiconductor die and a substrate designed to receive the semiconductor die. The substrate features apertures positioned below the semiconductor die, effectively providing moisture relief during temperature fluctuations. The semiconductor die is wire bonded to the substrate and sealed by an encapsulant that bonds and protects its surface.

Another significant patent is the "Low Profile Exposed Die Chip Carrier Package." This integrated circuit package includes a semiconductor die and a substrate that has a through-cavity opening for the die. The substrate's bottom side is equipped with solder pads arranged in a peripheral pad grid array. Similar to the previous invention, the semiconductor die is wire bonded to the top side of the substrate and encapsulated for protection. Notably, the design allows the bottom surface of the die to remain exposed, thereby eliminating moisture-related delamination issues and enhancing heat dissipation. The overall package design contributes to an ultra-low profile, which is beneficial in various applications.

Career Highlights

Glenn E. Gold has built his career within Motorola Corporation, a key player in the electronics industry. His innovative work has focused on improving integrated circuit packages, showcasing a commitment to addressing industry challenges and enhancing technological capabilities.

Collaborations

During his time at Motorola Corporation, Gold collaborated with notable colleagues such as Barry M. Miles and Robert W. Pennisi. Their collective expertise contributed to the development of cutting-edge technologies in semiconductor packaging, reflecting a team-oriented approach to innovation.

Conclusion

In summary, Glenn E. Gold's contributions as an inventor have significantly impacted the field of integrated circuit packaging. With four patents, he continues to drive advancements in technology, particularly with his latest designs that address common challenges in the semiconductor industry. His work exemplifies innovation that not only meets industry demands but also paves the way for future developments in electronics.