Giora J Dishon

Title: Giora J Dishon: Innovator in Solder Bump Technology

Introduction

Giora J Dishon is a notable inventor based in Chapel Hill, NC (US). He has made significant contributions to the field of microelectronics, particularly in the development of methods for forming solder bumps. His innovative approach has implications for the manufacturing processes in the electronics industry.

Latest Patents

Giora J Dishon holds a patent for a method of building solder bumps. This invention involves a unique process where a solder bump is formed on an under bump metallurgy. The method includes partially covering a contact pad on a substrate material with a passivation layer that is non-wettable by solder. The under bump metallurgy is designed to cover the portions of the contact pad that are not protected by the passivation layer. The process further involves depositing a layer of solder soluble metal on the under bump metallurgy, followed by coating it with solidified solder. The heating of the solder allows for the creation of a spheroid solder bump, enhancing the efficiency of electronic component assembly. Giora J Dishon has 1 patent to his name.

Career Highlights

Giora J Dishon is associated with the Microelectronics Center of North Carolina, where he has been instrumental in advancing solder bump technology. His work has contributed to the development of more reliable and efficient electronic components, which are crucial in today's technology-driven world.

Collaborations

Due to space constraints, the collaborations section has been omitted.

Conclusion

Giora J Dishon is a pioneering inventor whose work in solder bump technology has made a significant impact on the microelectronics industry. His innovative methods continue to influence the manufacturing processes of electronic components.