Company Filing History:
Years Active: 1996
Title: The Innovative Contributions of Gerry A Hackett
Introduction
Gerry A Hackett is a notable inventor based in Apalachin, NY (US). He has made significant contributions to the field of substrate laminating and circuitizing, holding a total of 2 patents. His work has advanced the technology used in various electronic applications.
Latest Patents
Gerry A Hackett's latest patents include an "Apparatus for laminating and circuitizing substrates having openings." This invention provides a method for laminating at least two substrates together while circuitizing at least one surface of the laminate. The process involves exerting pressure against opposite surfaces of the substrates, with a plug fitting into an opening on one of the substrates. This innovative method ensures that the circuit-receiving surface and the support surface are effectively sealed and circuitized with electrical circuitry.
Another patent, titled "Method of laminating and circuitizing substrates having openings therein," outlines a similar process. It emphasizes the importance of using a plug to support a sheet of dry film photoresist, which is crucial for developing a predetermined pattern on the surface. The method ensures that any remaining photoresist is stripped away, allowing for the removal of the plug member.
Career Highlights
Gerry A Hackett is currently associated with International Business Machines Corporation, commonly known as IBM. His role at IBM has allowed him to work on cutting-edge technologies and contribute to the advancement of electronic manufacturing processes.
Collaborations
Throughout his career, Gerry has collaborated with talented individuals such as Ashwinkumar C Bhatt and Thomas P Duffy. These collaborations have fostered innovation and have been instrumental in the development of his patented technologies.
Conclusion
Gerry A Hackett's contributions to the field of substrate laminating and circuitizing are noteworthy. His innovative patents and collaborations reflect his commitment to advancing technology in the electronics industry.