Company Filing History:
Years Active: 2003
Title: Gerd R Ley: Innovator in Die Placement Technology
Introduction
Gerd R Ley is a notable inventor based in San Jose, California. He has made significant contributions to the field of semiconductor technology, particularly in the area of die placement and bonding.
Latest Patents
Gerd R Ley holds a patent for an "Apparatus and method for the placement and bonding of a die on a substrate." This innovative apparatus features a movable die holder, a movable substrate holder, and a pivoting transfer arm. The transfer arm efficiently picks a die from the die holder and transfers it to a position adjacent to the substrate holder. Additionally, a bondhead assembly is included to pick the die from the transfer arm and bond it to the substrate.
Career Highlights
Gerd R Ley is associated with Endwave Corporation, where he has applied his expertise in developing advanced technologies. His work has been instrumental in enhancing the efficiency and precision of die placement processes.
Collaborations
Gerd has collaborated with notable colleagues, including Edwin F Johnson and Douglas Gene Lockie, contributing to various projects within the semiconductor industry.
Conclusion
Gerd R Ley's innovative work in die placement technology exemplifies the impact of inventors in advancing semiconductor manufacturing processes. His contributions continue to influence the industry positively.