Company Filing History:
Years Active: 2009
Title: George Sotiropoulos: Innovator in Integrated Circuit Technology
Introduction
George Sotiropoulos is a notable inventor based in Des Plaines, IL (US). He has made significant contributions to the field of integrated circuit technology, particularly in the area of thermal stress relief for multi-chip modules.
Latest Patents
Sotiropoulos holds a patent for an innovative mounting structure designed for integrated circuits. The patent, titled "Integrated circuit mounting for thermal stress relief useable in a multi-chip module," focuses on a mounting structure that enhances heat dissipation from the integrated circuit. This structure is insulative and is preferably made from a direct bond to copper (DBC) board. The design includes a heat spreading region where the IC is affixed, surrounded by bond pad areas that connect to the substrate. This connection is typically achieved through wire bonding, and thermal vias can be incorporated to further improve heat dissipation. He has 1 patent to his name.
Career Highlights
George Sotiropoulos is currently employed at Temic Automotive of North America, Inc. His work there emphasizes the importance of effective thermal management in integrated circuits, which is crucial for the reliability and performance of multi-chip modules.
Collaborations
Throughout his career, Sotiropoulos has collaborated with talented individuals such as Iyad Alhayek and Gerry Bianco. These collaborations have likely contributed to the innovative solutions he has developed in the field of integrated circuits.
Conclusion
George Sotiropoulos is a distinguished inventor whose work in integrated circuit technology has made a significant impact. His innovative patent for thermal stress relief in multi-chip modules showcases his expertise and commitment to advancing technology.