George Palmer

Title: George Palmer - Innovator in Dicing Technology

Introduction

George Palmer is an accomplished inventor based in Aptos, California. He is known for his innovative contributions to the field of dicing technology, particularly in the semiconductor industry. His work focuses on improving the efficiency and quality of die separation processes.

Latest Patents

Palmer holds a patent for a novel dicing system and methods titled "Saw Assisted Facet Etch Dicing." This invention presents a unique approach to separating die on a wafer in preparation for packaging. The method results in smooth diced edges, which is especially beneficial for edge-coupled photonic chips. By etching from the front side of the wafer and dicing from the back side, the process ensures complete separation of die while creating an optically smooth surface. This innovation allows for direct mounting of adjacent devices with minimal coupling loss and low optical scattering.

Career Highlights

George Palmer is currently employed at Genxcomm, Inc., where he continues to develop cutting-edge technologies. His expertise in dicing systems has positioned him as a key player in advancing semiconductor manufacturing processes. Palmer's work has significantly impacted the efficiency and effectiveness of die separation techniques.

Collaborations

Palmer collaborates with talented individuals such as Brian Mattis and Taran Huffman, who contribute to the innovative environment at Genxcomm, Inc. Their combined efforts foster a culture of creativity and technological advancement.

Conclusion

George Palmer's contributions to dicing technology exemplify the spirit of innovation in the semiconductor industry. His patented methods enhance the quality of die separation, paving the way for improved optical devices.