George F Laird, Iii

Title: The Innovations of George F. Laird III

Introduction

George F. Laird III is a notable inventor based in Baltimore, Maryland. He has made significant contributions to the field of microwave semiconductor components. His innovative approach has led to advancements in the integration and packaging of monolithic microwave integrated circuits (MMIC).

Latest Patents

Laird holds a patent for a method of packaging microwave semiconductor components. This patent focuses on using a motherboard made of high resistivity silicon, which has a thermal conductivity three times that of gallium arsenide. The use of ultra-high purity, uncompensated silicon is preferred in this method. Anisotropic etching of recesses in the motherboard allows for precise placement of MMICs, enabling automated die and wire bonding techniques that substantially reduce assembly time. Additionally, the silicon motherboard facilitates the incorporation of necessary control circuitry and effectively transmits RF energy, which is particularly beneficial for C-band and X-band applications.

Career Highlights

George F. Laird III is associated with Comsat Corporation, where he has applied his expertise in microwave technology. His work has been instrumental in advancing the capabilities of microwave integrated circuits.

Collaborations

Laird has collaborated with notable colleagues such as Bernard D. Geller and Johann U. Tyler. Their combined efforts have contributed to the success of various projects within the field.

Conclusion

George F. Laird III's innovative work in microwave semiconductor components has made a lasting impact on the industry. His patent and contributions to Comsat Corporation highlight his role as a key figure in advancing microwave technology.