Company Filing History:
Years Active: 2025
Title: Geng Hou: Innovator in Silicon Carbide Ceramic Manufacturing
Introduction
Geng Hou is a prominent inventor based in Guangdong, China. He has made significant contributions to the field of 3D printing, particularly in the manufacturing of silicon carbide ceramics. His innovative approach has led to the development of a unique method that enhances the production of complex-shaped ceramic parts.
Latest Patents
Geng Hou holds a patent for a method titled "Method for manufacturing silicon carbide ceramic special-shaped part with complex shape by plastic fused deposition modeling (FDM)-3D printing based on water debinding." This patent outlines a process that involves mixing graphite, carbon black, silicon carbide, and a surface modifier. The resulting mixture undergoes modification to create a surface modifier-coated composite ceramic powder. This powder is then mixed with a macromolecular binder to produce a ceramic 3D printing feed. The feed is subjected to 3D printing, debinding, and reaction sintering, resulting in a silicon carbide ceramic special-shaped part with a complex shape. Geng Hou's innovative method is a testament to his expertise in the field.
Career Highlights
Geng Hou is affiliated with Dongguan University of Technology, where he continues to advance his research and development efforts. His work has garnered attention for its practical applications in various industries, particularly in the realm of advanced materials and manufacturing techniques.
Collaborations
Geng Hou collaborates with notable colleagues, including Wei Liu and Muqi Luo. Their combined expertise contributes to the ongoing research and development in the field of ceramic manufacturing and 3D printing technologies.
Conclusion
Geng Hou's contributions to the field of silicon carbide ceramic manufacturing through innovative 3D printing methods highlight his role as a leading inventor. His work not only advances technology but also paves the way for future innovations in material science.