West Jefferson, NC, United States of America

Gary J Buczkowski


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 86(Granted Patents)


Company Filing History:


Years Active: 1997

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1 patent (USPTO):Explore Patents

Title: Innovations of Gary J Buczkowski

Introduction

Gary J Buczkowski is an accomplished inventor based in West Jefferson, NC (US). He is known for his innovative contributions to capacitor technology, particularly in the area of heat dissipation. His work has led to the development of a unique capacitor structure that addresses the challenges posed by high ripple currents.

Latest Patents

Gary holds a patent for a "High ripple current capacitor." This invention features a capacitor structure designed to effectively dissipate heat generated by high ripple currents. The capacitor includes an outer casing of substantially annular cross-section, which comprises an outer side wall, a bottom, and an interior tube integrally formed from a continuous piece of thermally conductive material. The capacitor winding, also of substantially annular cross-section, is disposed within the outer casing and is sealed at the top. This design allows the capacitor winding to maintain close thermal contact with the inner tube, bottom, and outer side wall, thereby improving heat dissipation.

Career Highlights

Gary is currently employed at United Chemi-con Manufacturing, where he continues to innovate in the field of capacitor technology. His work has significantly contributed to advancements in electronic components, enhancing their performance and reliability.

Collaborations

Throughout his career, Gary has collaborated with notable colleagues, including Thomas W Efford and Mitchell D Weaver. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Gary J Buczkowski's contributions to capacitor technology exemplify the spirit of innovation. His patented designs not only address critical challenges in heat dissipation but also pave the way for future advancements in electronic components.

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