Edison, NJ, United States of America

Gary Hua

This inventor holds 1 USPTO granted patent. Top assignee: Bel Fuse, Inc.. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Gary Hua. Retrieved from https://idiyas.com/inventor/gary-hua

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Gary Hua - Innovator in Electronic Device Design

Introduction

Gary Hua is a notable inventor based in Edison, NJ (US). He has made significant contributions to the field of electronic device design, particularly with his innovative approach to improving heat transfer in electronic packages.

Latest Patents

Gary holds a patent for an "Overmolded device with contoured surface." This electronic device features three-dimensional surface characteristics molded into an encapsulant, forming an advanced electronic package. The design enhances heat transfer compared to conventional electronic devices, showcasing Gary's commitment to innovation in technology. He has 1 patent to his name.

Career Highlights

Gary is currently employed at Bel Fuse, Inc., where he continues to develop cutting-edge electronic solutions. His work focuses on creating devices that not only meet industry standards but also push the boundaries of what is possible in electronic design.

Collaborations

Gary collaborates with his coworker, Marshall Miles, to further enhance the capabilities of their projects. Their teamwork exemplifies the importance of collaboration in driving innovation.

Conclusion

Gary Hua's contributions to electronic device design reflect his dedication to improving technology through innovative solutions. His work continues to inspire advancements in the field, making a lasting impact on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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