Company Filing History:
Years Active: 2005
Title: Gary Hua - Innovator in Electronic Device Design
Introduction
Gary Hua is a notable inventor based in Edison, NJ (US). He has made significant contributions to the field of electronic device design, particularly with his innovative approach to improving heat transfer in electronic packages.
Latest Patents
Gary holds a patent for an "Overmolded device with contoured surface." This electronic device features three-dimensional surface characteristics molded into an encapsulant, forming an advanced electronic package. The design enhances heat transfer compared to conventional electronic devices, showcasing Gary's commitment to innovation in technology. He has 1 patent to his name.
Career Highlights
Gary is currently employed at Bel Fuse, Inc., where he continues to develop cutting-edge electronic solutions. His work focuses on creating devices that not only meet industry standards but also push the boundaries of what is possible in electronic design.
Collaborations
Gary collaborates with his coworker, Marshall Miles, to further enhance the capabilities of their projects. Their teamwork exemplifies the importance of collaboration in driving innovation.
Conclusion
Gary Hua's contributions to electronic device design reflect his dedication to improving technology through innovative solutions. His work continues to inspire advancements in the field, making a lasting impact on the industry.